ON Semiconductor Adds System-in-Package Module for Connected Bluetooth Applications

ON Semiconductor, driving energy efficient innovations, has extended its RSL10 family of Bluetooth 5 certified radio System-on-Chips (SoCs) with a ready-to-use 6 x 8 x1.46 mm System-in-Package (SiP) module. Supporting Bluetooth low energy wireless profiles, RSL10 devices can be easily designed into any ‘connected’ application including sports/fitness or mHealth wearables, smart locks and appliances.

The RSL10 SIP features a built-in antenna, RSL10 radio, and all required passive components in one complete, miniature solution. Certified with the Bluetooth Special Interest Group (SIG), the RSL10 SIP significantly reduces time-to-market and development costs by removing the need for any additional RF design considerations.

With the two megabits per second (Mbps) speeds possible with Bluetooth 5 alongside the industry’s lowest power consumption, the RSL10 family provides advanced wireless functionality without compromising battery application life. RSL10 consumes just 62.5 nanowatts (nW) while in Deep Sleep mode, and 7 milliwatts (mW) peak receive power. RSL10’s energy efficiency was recently validated by the EEMBC’s ULPMark where it became the first device in the benchmark’s history to break 1,000 ULP Marks and produced Core Profile scores more than twice as high as the previous industry leader.   

“With its best-in-class power consumption, it’s not surprising that RSL10 has already been selected for use in a number of applications including energy harvesting and industrial IoT,” said Michel De Mey, senior director and general manager, Hearing, Consumer Health, and Bluetooth Connectivity solutions, ON Semiconductor. “By adding a new System-in-Package that significantly reduces design efforts, costs and time-to-market, the possibilities for RSL10 are endless.”